Intelligent Cleaning: The equipment uses a fully automatic loading/unloading cleaning mode to clean silicon wafers. It is compatible with cleaning multiple sizes of silicon wafers, offering strong expandability.

Automatic Transfer: Equipped with an automated manipulator featuring flexible movement and precise positioning, it can automatically complete object extraction, movement, and placement according to preset programs. This achieves fully automated cleaning, reduces manual intervention, and ensures consistent cleaning quality.

Clean Cleaning Tanks: The equipment is configured with mirror-finish stainless steel clean cleaning tanks with four-sided overflow functions to prevent dirt residue. A circulating filtration system is also included to improve the cleanliness level of the cleaning equipment.

Multi-Functional Cleaning: During the cleaning process, it not only uses ultrasonic cleaning but also integrates multiple cleaning methods such as spraying, tossing, bubbling, and jet flow.

Rotary System: The equipment is equipped with a rotary system, allowing the chip to continuously rotate during cleaning. The rotation speed can be adjusted according to the cleaning process to enhance cleaning quality.

Environmentally Friendly Closed Design: The whole machine adopts a fully enclosed structure with stainless steel material, paired with a PPU air purification unit and an air extraction system. This ensures the equipment meets cleanliness standards, creates a high-purity environment, and satisfies customers’ strict requirements for products and the environment.